1) Metal sputtering targets List: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), Dysprosium (Dy), Erbium (Er), Europium (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, Carbon, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe), lanthanum (La), Lead (Pb), Lutetium (Lu), Manganee (Mn), Molybdenum (Mo), Magnesium (Mg),Neodymium (Nd), Niobiums (Nb), Nickel (Ni), Palladium (Pd),Platinum (Pt), Praseodymium (Pr),Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc),Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin (Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn)2)
2) Alloy sputtering target: AlCu, AlCr, AlMg, AlSi, AlSiCu, AlAg, AlV, CaNiCrFe, CaNiCrFeMoMn, CeGd, CeSm, CrSi, CoCr,CoCrMo, CoFe, CoFeB ,CoNi, CoNiCr, CoPt, CoNbZr, CoTaZr, CoZr, CrV, CrB, CrSi, CrCu, CuCo, CuGa, CuIn, CuNi, CoNiPt, CuZr,DyFe, DyFeCo, FeB,FeC, FeMn, GdFe, GdFeCo, HfFe, IrMn, IrRe, InSn, MoSi, NiAl, NiCr, NiCrSi, NdDyFeCo, NiFe, NiMn, NiNbTi, NiTi, NiV, SmCo, AgCu, AgSn, TaAl, TbDyFe, TbFe, TbFeCo, TbGdFeCo, TiAl, TiNi, TiCr, WRe, WTi, WCu, ZrAl, ZrCu, ZrFe, ZrNb, ZrNi, ZrTi, ZrY, ZnAl, ZnMg
3)Ceramic Sputtering Target
Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, Cr5B3, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, NbB2, TaB, TaB2, TiB2, W2B, WB, VB, VB2, ZrB2
Carbide Ceramic Sputtering Targets : B4C,Cr3C2,HfC,Mo2C,NbC,SiC,TaC, TiC, WC, W2C, VC, ZrC
Fluoride Ceramic Sputtering Targets : AlF3, BaF3, CdF2, CaF2, CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3, MgF2, NdF3, ReF3, SmF3, NaF, Cryolite, Na3AlF6 , SrF2, ThF4, YF3, YbF3
Nitrides Ceramic Sputtering Targets :AlN, BN,GaN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN
Oxide Ceramic Sputtering targets: Al2O3, Sb2O3, ATO ,BaTiO3, Bi2O3, CeO2, CuO, Cr2O3 ,Dy2O3 ,Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, ITO, Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu3Fe5O12, Lu2O3, MgO, MoO3, Nd2O3, Pr6O11, Pr(TiO2)2, Pr2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, ThO2, Tm2O3, TiO2, TiO, Ti3O5, Ti2O3, SnO2, SnO, WO3, V2O5, YAG, Y3Al5O12, Yb2O3, Y2O3, ZnO, ZnO:Al, ZrO2(unstabilized), ZrO2-5-15wt%CaO)
Selenides Ceramic Sputtering Targets: Bi2Se3, CdSe, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe
Silicides Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2
Sulfides Ceramic Sputtering Targets: Sb2S3, As2S3, CdS, FeS, PbS, MoS2, NbS1.75, TaS2, WS2, ZnS
Tellurides Ceramic Sputtering Targets: CdTe, PbTe, MoTe2, NbTe2, TaTe2, WTe2, ZnTe
Other: Cr-SiO, GaAs, Ga-P, In-Sb, InAs, InP, InSn, LSMO, YBCO, LCMO
4)Substrate wafer: Al2O3, , BaF2, CaF2, GaAs, GaP, Ge, InP, LiNbO3, LiTaO3, MgO, MgF2, Si, SiO2
2. Evaporation Materials.
1）Fluoride Evaporation Materials: AlF3, BaF2,CdF2, CaF2, CeF3, DyF3, ErF3 ,HfF4, KF, LaF3, PbF2, PrF3 LiF, MgF2, NdF3, ReF3, SmF3, NaF, Na3AlF6, Cryolite ,SrF2 ,ThF4, YF3,YbF3.
2)Metal Evaporation Materials : Al ,Sb, Ce ,Cr, Co, Cu, Dy, Er,Eu ,Gd, Ge, Au, Hf ,Ho, Fe,La ,Lu, Mg, Nd, Ni ,Pr,Pt, Sm, Sc, Ag, Te, Tb, Tm, Ti, Yb, Y
3)Oxide Evaporation Materials :Al2O3, Sb2O3, ATO, BaTiO3 ,Bi2O3, CeO2, CuO, Cr2O3,Dy2O3, Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3 ,In2O3, ITO,Fe2O3, Fe3O4,La2O3, LaAlO3, PbTiO3, PbZrO3, LiNbO3, LiO, LiTaO3, Lu3Fe5O12, Lu2O3,Mno, MgTiO3, MoO3, Nd2O3, Nb2O5, Pr6O11, Pr(TiO2)2, Pr2O3 ,Sm2O3, Sc2O3, SiO2,SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, ThO2, Tm2O3, TiO2 ,TiO, Ti3O5, Ti2O3, SnO2, SnO, WO3, V2O5 ,Y3Al5O12, Yb2O3, Y2O3, YAG, ZnO, ZnO:Al ,ZrO2 ZrOCaO, YO
4)Mixture Evaporation Material :Al2O3+MgO 1:1, Al2O3+ZrO2 6:4, Al2O3+ZnO, Sb2O3+SnO2 9:1(ATO) ,ZnO+Al2O3 (AZO) ,CaF2 +CeF3 1:1, In2O3+SnO2 90:10 95:5 65:35 (ITO), TiO2+Nb2O5 7:3, Ta2O5+TiO2 1:1, Ta2O5+ZrO2 3:7 ,TiO2+ZrO2 1:1 ,Y2O3+ZrO2 1:4
5) Other Evaporation Material : AlN, BaFeO3, BaTiO3, BT, BN, CdS, CdTe, CrW, Na3AiF6, GaAs ,HfN, FeB ,LaB6, LaTiO3, LiTaO3,LiNbO3, PbS, PbTe ,MgT, NbN, InSb, PrTiO3 ,Si3N4, SiC, SrTiO3, TaN, TaC, TiB2, TiC, TiN ,WC,YBC, ZnSe, ZnTe ,ZnS
6) Tungsten Filament Coils, Boat, Crucible., est : BN ,Cu, C, Au ,Mo, Nb, Pt, SiO2, Ta, W ,TiB2,Al2O3, ZrB2,ZrO2, Mo,
3.Spraying Powder
1)Metal materials: Al Powder, Al wire, Cu Powder ,Cu wire, Zn wire, Mo wire,Mo Powder,Ni Powder,Nb Powder,Ag Powder ,Ti Powder,Ta Powder,W Powder,Metco404
,Metco450
2)Alloy materials:AlCu wire ,AlMg wire,AlSi powder ,S S Wire ,Cu,Sb Sn Wire ,FeCrAl wire,NiCu Alloy Wire, NiCu Alloy powder ,NiAl wire,NiCo CrAl YOPowder ,NiCr 80:20, Powder (Metco43)
,NiCr powder (50:50) ,NiCuIn Powder ,AgCu Alloy Powder,SnZn wire,ZnAl Wire,Ceramic materials,Al2O3 powder ,Al2O3 Rod ,Al2O3-TiO2,Cr3C2 Powder,Cr3C2-NiCr Powder,Cr2O3 powder,Cr2O3 Rod ,TiC Powder,TiO2 Powder,WC Powder,WC-Co,WC-Co,WC-Co,ZrO2 Powder, ZrO2 Rod
4. Semiconductor Material:
1) Single Semiconductor Materials: As, Cd, Ga, Ge, In ,Pb ,Se ,Te ,Si
2) Compound Semiconductor Material: AlSb,Al2S3, Al2Se3 ,Al2Te3,Bi2S3,Sb2S3,,Sb2Se3
Sb2Te3, As2S3, As2Se3, As2Te3, Bi2Se3, Bi2Te3, Bi2Se3, Bi2Te3, CdAs2, Cd3As2, CdSb, Cu2S, CdS, CdTe, CdSe, GaAs, GaSb , GaS, Ga2S3, GaSe , Ga2Se3, GaTe , GeS, GeSe, GeSe2, GeTe, InBi , InAs, InP, InSb, InSe, In2Se3, InbS, InTe, In2Te, PbO, PbS, In2S3, Pe, PbTe, Mg2Si, SnS,SnSe, SnSe2, SnTe, Ag2S, Ag2Se, ZnTe, ZnAs2, Zn3As2, ZnSb, Zn3P2, ZnS, ZnSe, Ag2Te |
